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1. Handbook of wafer bonding / [electronic resource]

by Ramm, Peter; Lu, James Jian-Qiang; Taklo, Maaike M. V.

Material type: book Book; Format: available online remote; Literary form: not fiction Publisher: Weinheim : Wiley-VCH, ©2012Online Access: Wiley Online Library Availability: No items available

2. Handbook of 3D Integration : 3D process technology / [electronic resource]

by Garrou, Philip E; Koyanagi, Mitsumasa; Ramm, Peter.

Material type: book Book; Format: available online remote; Literary form: not fiction Publisher: Weinheim, Germany : Wiley-VCH, 2014.Online Access: Wiley Online Library Availability: No items available

Last Updated on September 15, 2019
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