| 000 | 07012cam a2200649Ia 4500 | ||
|---|---|---|---|
| 001 | ocn714797067 | ||
| 003 | OCoLC | ||
| 005 | 20171119090600.0 | ||
| 006 | m o d | ||
| 007 | cr cn||||||||| | ||
| 008 | 110426s2010 njua ob 001 0 eng d | ||
| 020 |
_a9780470950012 _q(electronic bk.) |
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| 020 |
_a0470950013 _q(electronic bk.) |
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| 020 | _a9780470250020 | ||
| 020 | _a047025002X | ||
| 024 | 7 |
_a10.1002/9780470950012 _2doi |
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| 029 | 1 |
_aAU@ _b000049641561 |
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| 029 | 1 |
_aDEBSZ _b347987028 |
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| 029 | 1 |
_aNZ1 _b13876195 |
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| 029 | 1 |
_aNZ1 _b15341290 |
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| 029 | 1 |
_aDEBBG _bBV043392982 |
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| 035 | _a(OCoLC)714797067 | ||
| 037 |
_a10.1002/9780470950012 _bWiley InterScience _nhttp://www3.interscience.wiley.com |
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| 040 |
_aDG1 _beng _cDG1 _dMYG _dDEBSZ _dOCLCQ _dOCLCA _dOCLCQ _dOCLCF _dOCLCQ |
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| 049 | _aMAIN | ||
| 050 | 1 | 4 |
_aTK7870.23 _b.S77 2010 |
| 082 | 0 | 4 |
_a621.382 _222 |
| 245 | 0 | 0 |
_aStructural dynamics of electronic and photonic systems / _cedited by Ephraim Suhir, T.X. Yu, Eric Connally. _h[electronic resource] |
| 260 |
_aHoboken, N.J. : _bWiley, _c2010. |
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| 300 |
_a1 online resource (x, 598 pages) : _billustrations |
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| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bc _2rdamedia |
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| 338 |
_aonline resource _bcr _2rdacarrier |
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| 504 | _aIncludes bibliographical references and index. | ||
| 505 | 0 | _aFrontmatter -- Some Major Structural Dynamics-Related Failure Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic Stability of These Systems / David S Steinberg -- Linear Response to Shocks and Vibrations / Ephraim Suhir -- Linear and Nonlinear Vibrations Caused by Periodic Impulses / Ephraim Suhir -- Random Vibrations of Structural Elements in Electronic and Photonic Systems / Ephraim Suhir -- Natural Frequencies and Failure Mechanisms of Electronic and Photonic Structures Subjected to Sinusoidal or Random Vibrations / David S Steinberg -- Drop/Impact of Typical Portable Electronic Devices: Experimentation and Modeling / T X Yu, C Y Zhou -- Shock Test Methods and Test Standards for Portable Electronic Devices / C Y Zhou, T X Yu, S W Ricky Lee, Ephraim Suhir -- Dynamic Response of Solder Joint Interconnections to Vibration and Shock / David S Steinberg -- Test Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating Electronic Equipment / David S Steinberg -- Correlation between Package-Level High-Speed Solder Ball Shear/Pull and Board-Level Mechanical Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy / Fubin Song, S W Ricky Lee, Keith Newman, Bob Sykes, Stephen Clark -- Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging / V B C Tan, K C Ong, C T Lim, J E Field -- Fatigue Damage Evaluation for Microelectronic Components Subjected to Vibration / T E Wong -- Vibration Considerations for Sensitive Research and Production Facilities / E E Ungar, H Amick, J A Zapfe -- Applications of Finite Element Analysis: Attributes and Challenges / Metin Ozen -- Shock Simulation of Drop Test of Hard Disk Drives / D W Shu, B J Shi, J Luo -- Shock Protection of Portable Electronic Devices Using a ₃Cushion₄ of an Array of Wires (AOW) / Ephraim Suhir -- Board-Level Reliability of Lead-Free Solder under Mechanical Shock and Vibration Loads / Toni T Matilla, Pekka Marjamaki, Jorma Kivilahti -- Dynamic Response of PCB Structures to Shock Loading in Reliability Tests / Milena Vujosevic, Ephraim Suhir -- Linear Response of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions? / Ephraim Suhir -- Shock Isolation of Micromachined Device for High- Applications / Sang-Hee Yoon, Jin-Eep Roh, Ki Lyug Kim -- Reliability Assessment of Microelectronics Packages Using Dynamic Testing Methods / X Q Shi, G Y Li, Q J Yang -- Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies / Reza Ghaffarian -- Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse? / Ephraim Suhir, Luciano Arruda -- Index. | |
| 520 |
_a"The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components' level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice"-- _cProvided by publisher. |
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| 520 |
_a"The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading"-- _cProvided by publisher. |
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| 533 |
_aElectronic reproduction. _bHoboken, N.J. : _cWiley InterScience, _d2011. _nMode of access: World Wide Web. _nSystem requirements: Web browser. _nTitle from title screen (viewed on Apr. 21, 2011). _nAccess may be restricted to users at subscribing institutions. |
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| 650 | 0 |
_aElectronic apparatus and appliances _xReliability. |
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| 650 | 0 |
_aOptoelectronic devices _xReliability. |
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| 650 | 0 | _aFault tolerance (Engineering) | |
| 650 | 0 | _aMicrostructure. | |
| 650 | 0 | _aStructural dynamics. | |
| 650 | 7 |
_aElectronic apparatus and appliances _xReliability. _2fast _0(OCoLC)fst00906827 |
|
| 650 | 7 |
_aFault tolerance (Engineering) _2fast _0(OCoLC)fst00921986 |
|
| 650 | 7 |
_aMicrostructure. _2fast _0(OCoLC)fst01020118 |
|
| 650 | 7 |
_aOptoelectronic devices _xReliability. _2fast _0(OCoLC)fst01046916 |
|
| 650 | 7 |
_aStructural dynamics. _2fast _0(OCoLC)fst01135648 |
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| 655 | 4 | _aElectronic books. | |
| 700 | 1 | _aSuhir, Ephraim. | |
| 700 | 1 |
_aYu, T. X. _q(Tongxi), _d1941- |
|
| 700 | 1 | _aConnally, Eric. | |
| 710 | 2 | _aWiley InterScience (Online service) | |
| 776 | 0 | 8 |
_iPrint version: _tStructural dynamics of electronic and photonic systems. _dHoboken, N.J. : Wiley, 2010 _z9780470250020 _w(DLC) 2010031072 _w(OCoLC)642840093 |
| 856 | 4 | 0 |
_uhttp://onlinelibrary.wiley.com/book/10.1002/9780470950012 _zWiley Online Library |
| 942 |
_2ddc _cBK |
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| 999 |
_c204988 _d204988 |
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