| 000 | 04803cam a2200745Ia 4500 | ||
|---|---|---|---|
| 001 | ocn779616373 | ||
| 003 | OCoLC | ||
| 005 | 20171115085647.0 | ||
| 006 | m o d | ||
| 007 | cr cn||||||||| | ||
| 008 | 120309s2012 gw a obf 001 0 eng d | ||
| 020 |
_a9783527644247 _q(electronic bk.) |
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| 020 |
_a3527644245 _q(electronic bk.) |
||
| 020 | _z3527644245 | ||
| 020 | _z9783527644223 | ||
| 020 | _z3527644229 | ||
| 020 | _z9783527644230 | ||
| 020 | _z3527644237 | ||
| 020 | _z9783527644254 | ||
| 020 | _z3527644253 | ||
| 020 | _z3527326464 | ||
| 020 | _z9783527326464 | ||
| 029 | 1 |
_aAU@ _b000049013971 |
|
| 029 | 1 |
_aAU@ _b000053017069 |
|
| 029 | 1 |
_aDEBBG _bBV041829410 |
|
| 029 | 1 |
_aDEBSZ _b372696236 |
|
| 029 | 1 |
_aDKDLA _b820120-katalog:000600708 |
|
| 029 | 1 |
_aNZ1 _b14696616 |
|
| 029 | 1 |
_aNZ1 _b15340966 |
|
| 035 |
_a(OCoLC)779616373 _z(OCoLC)785777901 _z(OCoLC)794707297 _z(OCoLC)961632813 _z(OCoLC)962650779 |
||
| 037 |
_a10.1002/9783527644223 _bWiley InterScience _nhttp://www3.interscience.wiley.com |
||
| 040 |
_aDG1 _beng _epn _cDG1 _dE7B _dYDXCP _dGZM _dOCLCO _dDEBSZ _dOCLCQ _dN$T _dOCLCF _dOCLCQ _dCDX _dCOO _dOCL _dOCLCQ _dAZK _dDG1 |
||
| 049 | _aMAIN | ||
| 050 | 4 |
_aQC611.6.S9 _bH36 2012 |
|
| 072 | 7 |
_aTEC _x008090 _2bisacsh |
|
| 072 | 7 |
_aTEC _x008100 _2bisacsh |
|
| 082 | 0 | 4 |
_a621.38152 _222 |
| 245 | 0 | 0 |
_aHandbook of wafer bonding / _cedited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo. _h[electronic resource] |
| 260 |
_aWeinheim : _bWiley-VCH, _c©2012. |
||
| 300 |
_a1 online resource (xxxi, 395 pages) : _billustrations (some color) |
||
| 336 |
_atext _btxt _2rdacontent |
||
| 337 |
_acomputer _bc _2rdamedia |
||
| 338 |
_aonline resource _bcr _2rdacarrier |
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| 347 |
_adata file _2rda |
||
| 380 | _aBibliography | ||
| 380 | _aHandbook | ||
| 500 | _aWritten by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices. | ||
| 504 | _aIncludes bibliographical references and index. | ||
| 505 | 0 | _aFront Matter -- Technologies. Glass Frit Wafer Bonding / Roy Knechtel -- Wafer Bonding Using Spin-On Glass as Bonding Material / Viorel Dragoi -- Polymer Adhesive Wafer Bonding / Frank Niklaus, Jian-Qiang Lu -- Anodic Bonding / Adriana Cozma Lapadatu, Kari Schj̜lberg-Henriksen -- Direct Wafer Bonding / Manfred Reiche, Ulrich G̲sele -- Plasma-Activated Bonding / Maik Wiemer, Dirk Wuensch, Joerg Braeuer, Thomas Gessner -- Au/Sn Solder / Hermann Oppermann, Matthias Hutter -- Eutectic Au?In Bonding / Mitsumasa Koyanagi, Makoto Motoyoshi -- Thermocompression Cu?Cu Bonding of Blanket and Patterned Wafers / Kuan-Neng Chen, Chuan Seng Tan -- Wafer-Level Solid₆Liquid Interdiffusion Bonding / Nils Hoivik, Knut Aasmundtveit -- Hybrid Metal/Polymer Wafer Bonding Platform / Jian-Qiang Lu, J Jay McMahon, Ronald J Gutmann -- Cu/SiO Hybrid Bonding / Ľa Di Cioccio -- Metal/Silicon Oxide Hybrid Bonding / Paul Enquist -- Applications. Microelectromechanical Systems / Maaike M V Taklo -- Three-Dimensional Integration / Philip Garrou, James Jian-Qiang Lu, Peter Ramm -- Temporary Bonding for Enabling Three-Dimensional Integration and Packaging / Rama Puligadda -- Temporary Adhesive Bonding with Reconfiguration of Known Good Dies for Three-Dimensional Integrated Systems / Armin Klumpp, Peter Ramm -- Thin Wafer Support System for above 250ʻC Processing and Cold De-Bonding / Werner Pamler, Franz Richter -- Temporary Bonding: Electrostatic / Christof Landesberger, Armin Klumpp, Karlheinz Bock -- Index. | |
| 588 | 0 | _aPrint version record. | |
| 650 | 0 |
_aSemiconductor wafers _vHandbooks, manuals, etc. |
|
| 650 | 0 |
_aSemiconductors _xBonding _vHandbooks, manuals, etc. |
|
| 650 | 7 |
_aTECHNOLOGY & ENGINEERING _xElectronics _xSemiconductors. _2bisacsh |
|
| 650 | 7 |
_aTECHNOLOGY & ENGINEERING _xElectronics _xSolid State. _2bisacsh |
|
| 650 | 7 |
_aSemiconductor wafers. _2fast _0(OCoLC)fst01112189 |
|
| 650 | 7 |
_aSemiconductors _xBonding. _2fast _0(OCoLC)fst01112201 |
|
| 655 | 4 | _aElectronic books. | |
| 655 | 7 |
_aHandbooks and manuals. _2fast _0(OCoLC)fst01423877 |
|
| 700 | 1 | _aRamm, Peter. | |
| 700 | 1 | _aLu, James Jian-Qiang. | |
| 700 | 1 | _aTaklo, Maaike M. V. | |
| 776 | 0 | 8 |
_iPrint version: _tHandbook of wafer bonding. _dWeinheim : Wiley-VCH, ©2012 _z9783527326464 _w(OCoLC)781684626 |
| 856 | 4 | 0 |
_uhttp://onlinelibrary.wiley.com/book/10.1002/9783527644223 _zWiley Online Library |
| 942 |
_2ddc _cBK |
||
| 999 |
_c205691 _d205691 |
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