| 000 | 01050cam a22002771 4500 | ||
|---|---|---|---|
| 001 | 2191563 | ||
| 003 | BD-DhUL | ||
| 005 | 20150117163621.0 | ||
| 008 | 740706s1962 coua b 100 0 eng | ||
| 010 | _a 72187721 | ||
| 040 |
_aDLC _cDLC _dDLC _dBD-DhUL |
||
| 050 | 0 | 0 |
_aTK7870 _b.I574 1961 |
| 082 |
_a621.381046 _bWAA |
||
| 111 | 2 |
_aInternational Electronic Circuit Packaging Symposium _n(2nd : _d1961 : _cBoulder, Colo.) |
|
| 245 | 1 | 0 |
_aAdvances in electronic circuit packaging : _bproceedings; vol. 2 / _cEdited by Gerald A. Walker. |
| 260 |
_aEnglewood, Colo. ; _bRogers Pub. Co.; _cC1962. |
||
| 300 |
_axiv, 328 p. : _bills. ; _c26 cm. |
||
| 500 | _a"Sponsored by the University of Colorado and EDN (Electrical design news)." | ||
| 504 | _aIncludes bibliographical references. | ||
| 650 | 0 |
_aElectronic packaging _xCongresses. |
|
| 700 | 1 |
_aWalker, Gerald A., _eeditor. |
|
| 710 | 2 | _aUniversity of Colorado (Boulder campus) | |
| 730 | _aElectrical design news. | ||
| 906 |
_a7 _bcbc _corignew _du _encip _f19 _gy-gencatlg |
||
| 942 |
_2ddc _cBK |
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| 999 |
_c32228 _d32228 |
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